Our Outsourced Assembly and Test Partners (OSAT), have more than 10 years of experience in Semiconductor Packaging. Offers a wide range of Package options from Leaded, Leadless to advanced Multi Chip Packaging technology. Uses state of the art equipment’s and technology.
The company has been certified ISO 9002:1994, QS9000 and ISO 14001 to assure best quality services for the Customers.
Our Assembly & Test Partner
Incorporated in 1996, ATEC is driven by our vision of being our strategic partner to our customers, focusing on customized service and offering a consistently first-rate and dynamic range of technical capabilities. We provide a full array of semiconductor assembly and test services, ranging from discrete to complex multichip packages, from low volume, quick turns to high volume production.
Our products are found in a wide array of applications, including voice and data communication, industrial, commercial, consumer and office electronics, computers, military, automotive, and many other industries.